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Solder wire



Itern Specification
Sn-zn,Sn-Bi low temperature
Solder wire for Alumium
Solder wire for stainless steel
Solder wire for lamp holder
Any alloy composition available
Any diameter available
Common dia:0.8-5mm

Code Alloy melting temperature(℃) Product feature, purpose and precautions
Solidus Liquidus
HG-X100 Sn99.9 232 232  •The flux core remains continuous and average, with stable performance;
 •It is superficially bright, with pure alloy and highly even chemical elements;
 •Good wettability, diffuse flow and ability to fill welds;
 •Bright, round and beautiful solder joints;
It is suitable for various manual and automatic solders.
 1、It is recommended to use the constant temperature soldering iron of more than 100℃ above the liquidus for welding;
 2、The flux activity is divided into L, M, H; its content is divided into 1.1%, 2.2%, 3.3%; the diameter ranges from Φ0.3 to 2.0 for selection;

 3、In using tin wire of H-type flux, it needs to be cleaned after welding.
HG-X101 SnCu0.5 227 232
HG-X102 SnCu0.7 227 227
HG-X301 SnAg3Cu0.5 217 218
HG-X303 SnAg0.3Cu0.7 217 223
HG-X501 Sn42Bi58 139 139

All specification can be customized
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